Detailed Product Description

Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow

processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with

an effective first print down to 20 mils. EP256 is a solderpaste formula that maintains its activity and

printing characteristics for up to 8 hours without any shear thinning.

EP256 is a no-clean formula. The residues don't need to be removed for typical applications. Although

EP256 is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line or batch) with a variety of readily available cleaning agents.

EP256 is rosin based no-clean flux. The non-volatile portion of the material is classified as rosin type (symbol RO) per IPC J-STD-004.